Copper matrix composites with excellent comprehensive properties have potential applications in electronic packaging, electrical contact and other fields. However, overcoming the strength-plasticity inversion relationship of materials has always been a great challenge, and designing a layered configuration is considered to be an effective strategy for solving the inversion problem. In this work, Cu-TiB2/Cu layered composites with overlapping Cu layer and TiB2/Cu composite layer were prepared by powder metallurgy and in situ reaction methods. The tensile properties and fracture characteristics of the Cu-TiB2/Cu layered composites were studied, and the effect of the layered structural parameters on the composite properties was discussed. When the thickness ratio of the Cu layer to the TiB2/Cu composite layer is 1∶3, the ultimate tensile strength(UTS) of the Cu-TiB2/Cu laminated composite is 315 MPa, and the elongation at break is 18%, which indicates good strong plastic matching. Based on the characterization and analysis of the crack propagation paths of composite materials, the mechanism through which layered configuration design inhibits crack propagation and promotes crack deflection is revealed. This study provides a new idea for the configuration design and performance optimization of copper matrix composites with high strength and plasticity.