At present, copper bonding wire is widely used in electronic packaging, integrated circuits and other microelectronics industries instead of gold bonding wire because of its low price and excellent material properties. In this paper, gold wire, copper wire, silver wire and aluminum wire with high market shares are analysed, and the advantages of copper bonding wire instead of traditional bonded wire materials are highlighted. The research progress of copper wire preparation and bonding processes is briefly introduced and the packaging failure forms of copper bonding wires are briefly analysed. The trace elements commonly added in copper bonding wire and their mechanism of action are listed. Finally, the development trend of copper bonding wire market is analysed from the aspects of market demand and related policies.