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定向凝固 Cu-50%Sn 包晶合金显微组织演变
Microstructure Evolution of Directionally Solidified Cu-50%Sn Peritectic Alloy
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- DOI:
- 作者:
- 彭 鹏 1 ， 2 ，刘 林 2 ，喻杨新 1 ，甘 露 1 ，杨文超 2 ，徐远丽 1
PENG Peng 1,2 , LIU Lin 2 , YU Yangxin 1 , GAN Lu 1 , YANG Wenchao 2 , XU Yuanli 1
- 作者单位:
- 1. 兰州大学 材料与能源学院，甘肃 兰州 730000；2. 西北工业大学 凝固技术国家重点实验室，陕西 西安 710072
1. School of Materials & Energy, Lanzhou University, Lanzhou 730000, China; 2. State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi'an 710072, China
- 关键词:
- 定向凝固；包晶合金；凝固组织；金属间化合物
directional solidification; peritectic alloy; solidification microstructure; intermetallic compound
- 摘要:
- 随着科学技术的进步，越来越多的包晶合金因其优良性能广泛应用于工业生产领域，比如 Fe-Cr-Ni 、 Ti-Al 、Nd-Fe-B 合金以及应用于电子封装领域的 Cu-Sn 合金等。 随着电子信息产业向微型化和多功能化方向发展，对集成电路的机械、电子和热性能提出了更高的要求。本文以 Cu-50%Sn( 原子分数 ) 包晶合金 (L+Cu 3 Sn→Cu 6 Sn 5 ) 作为研究对象，通过布里奇曼定向凝固法，在显微镜下对组织进行观察和测量，研究淬火固液界面的凝固组织随凝固条件改变而产生的变化。 生长距离、温度梯度一定时，随着生长速度的增大，初生相 Cu 3 Sn 经历了胞状 → 胞 / 枝状 → 枝晶状组织转变， Cu 3 Sn相的尺寸与间距均随生长速度的增大而减小；生长速度、生长距离一定时，随着温度梯度的增大，初生相 Cu 3 Sn 相由块状与枝晶状转变为胞状组织；生长速度、温度梯度一定时，随着生长距离的增大，初生相 Cu 3 Sn 由块状与胞 / 枝状转变为胞状组织，且 Cu 3 Sn 相尺寸发生小幅细化。 基于上述实验结果，绘制了关于生长速度、温度梯度及生长距离条件下的显微组织选择图，进一步阐明了凝固条件的改变对 Cu-50%Sn( 原子分数 ) 包晶合金显微组织的影响。With the progress of science and technology, an increasing number of peritectic alloys, such as Fe-Cr-Ni, Ti-Al, and Nd-Fe-B alloys and Cu-Sn alloys for eletronic packaging, are being widely used in industrial production fields because of their excellent properties. With the development of the electronic information industry towards miniaturization and multifunctionality, higher requirements are put forward for the mechanical, electronic and thermal properties of integrated circuits. In this paper, Cu-50 at. %Sn peritectic alloy (L+Cu 3 Sn→Cu 6 Sn 5 ) was used as the research object. The Bridgman directional solidification method was used to observe and measure the microstructure under a microscope. When the growth distance and temperature gradient are constant, with increasing growth rate, the primary phase Cu 3 Sn undergoes a transformation from a cellular → cellular/dendritic → dendritic structure, and the size and spacing of the Cu 3 Sn phase decrease. When the growth rate and growth distance are constant, the primary phase Cu 3 Sn changes from a block and dendrite to a cellular structure with increasing temperature gradient. When the growth rate and temperature gradient are constant, with increasing growth distance, the primary phase Cu 3 Sn changes from block and cell/dendritic to cellular structure, and the size of the Cu 3 Sn phase is slightly refined. Based on the above experimental results, a diagram of the microstructure under different growth rates, temperature gradients and growth distances was drawn, and the influence of thesolidification conditions on the microstructure of the Cu-50 at. %Sn peritectic alloy are further clarified.