高导耐热铜基材料作为现代高新技术用关键材料之一，已被广泛应用于轨道交通、电子通信和航空航天等领域。本文从铜合金和铜基复合材料两大领域入手，介绍了常见高导耐热铜材料的设计思路、制备方法、微观组织结构、力学性能和物理性能，并对其导电机制和高温强化机理进行了归纳和阐释，最后对高导耐热铜基材料的研究现状和未来发展进行了总结与展望。

As key materials for modern advanced technology, copper-based materials with high conductivity and heat resistance have been widely used in many fields, such as rail transportation, electronic communications and aerospace. In this work, the design, preparation methods, microstructure, and mechanical and physical properties of common copper materials with high conductivity and heat resistance are introduced from the two major fields of copper alloys and copper matrix composites. In addition, the conductivity mechanism and high-temperature strengthening mechanism of the materials are summarized and explained. Finally, the research status and future development of copper materials with high conductivity and heat resistance are summarized and prospected.