目前，键合铜丝因其价格低廉、具有优良的材料性能等特点正逐渐替代键合金丝广泛应用于电子封装领域。 本文对当前市场上应用的金丝、铜丝、银丝及铝丝性能特点进行了分析对比，探讨了以键合铜丝替代传统键合丝材料的优势；简要介绍了铜丝材制备和键合过程的研究进展，并对键合铜丝的封装失效形式进行了简要分析；综述了微合金化对键合铜丝服役性能的影响规律及机理；最后从市场需求及理论研究方面分析了键合铜丝市场的发展趋势。

At present, copper bonding wire is widely used in electronic packaging, integrated circuits and other microelectronics industries instead of gold bonding wire because of its low price and excellent material properties. In this paper, gold wire, copper wire, silver wire and aluminum wire with high market shares are analysed, and the advantages of copper bonding wire instead of traditional bonded wire materials are highlighted. The research progress of copper wire preparation and bonding processes is briefly introduced and the packaging failure forms of copper bonding wires are briefly analysed. The trace elements commonly added in copper bonding wire and their mechanism of action are listed. Finally, the development trend of copper bonding wire market is analysed from the aspects of market demand and related policies.