研究了 Incoloy 825 合金在 1 223~1 473 K 温度范围内保温 0~150 min 后的晶粒长大行为，分析了加热温度和保温时间对其晶粒尺寸的影响，构建了 Incoloy 825 合金晶粒长大的数学模型。 结果表明，当温度低于 1 373 K 时，晶粒长大缓慢，晶粒尺寸变化不大；当温度高于 1 373 K 时，合金晶粒尺寸明显长大。 通过回归分析，构建了 Incoloy 825 合金两段式晶粒长大数学模型，能够较好地预测该合金在不同加热温度、不同保温时间下的晶粒尺寸。

It was studied the grain growth behavior of Incoloy 825 alloy within the temperature range from 1 223 to 1 473 K and holding time range from 0 to 150 min. The influence of the temperature and holding time on the grain size was analysed, and the evolution law of the grain size was studied. The results indicate that the grain size shows no remarkable growth with increasing temperature and holding time when the temperature is lower than 1 373 K. However, the grain size grows obviously with increasing temperature and holding time when the heating temperature is above 1 373 K. The two-stage grain growth model is established on the basis of regression analysis, which can well predict the grain size under different heating temperatures and holding time.