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金属型铸造Al-9Si-xCu合金的组织及传热性能
Microstructure and Heat Transfer Performance of Al-9Si-xCu Alloys for Permanent Mold Casting
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- DOI:
- 作者:
- 朱慧颖，翁文凭，王东涛，长海博文，王亚婧，黄鹏宇
ZHU Huiying, WENG Wenping, WANG Dongtao, HIROMI Nagaumi, WANG Yajing, HUANG Pengyu
- 作者单位:
- 苏州大学 沙钢钢铁学院，江苏 苏州 215137
School of Iron and Steel, Soochow University, Suzhou 215137, China
- 关键词:
- Al-Si 合金；Cu 元素；显微组织；热导率
Al-Si alloy; Cu element; microstructure; thermal conductivity
- 摘要:
- 本文采用水冷铜模铸造 Al-9Si-xCu 合金，分析了 Cu 含量对 Al-9Si 合金组织结构及传热性能的影响规律。
结 果 表 明，Al-9Si 合金的导热性能随 Cu 含 量 的 不 同，呈现出不同的下降趋势。 当 Cu 从 0 增 至 0.83%(质 量 分 数)
时，Cu元素以置换固溶体形式存在于基体， 引起晶格畸变并导致自由电子散射几率增加， 恶化导热性能， 热导率从
164.54 W/(m·K)降至 149.02 W/(m·K)；当 Cu 从 0.83%增至 2.00%(质量分数)，Cu 在基体已达饱和状态，以含 Cu 相 存
在，对热导率的影响相对较小；当 Cu 超过 2.65%(质量分数）时，含 Cu 相数量减少，并进一步长大，其形貌、数量和分布
上的变化有利于自由电子传输，一定程度减缓了合金热导率随 Cu 含量增加而下降的幅度。
The effect of Cu on the microstructure and heat transfer properties of Al-9Si alloys achieved by water-cooled copper mold casting has been investigated. The results show that the decreasing trend of thermal conductivity with various Cu contents is different. When the Cu content increases from 0 to 0.83%, the presence of Cu in the matrix as a replacement solid solution causes lattice distortion and increases the chance of free electron scattering, deteriorating the thermal conductivity from 164.54 W/(m·K) to 149.02 W/(m·K). As the Cu content increases from 0.83% to 2.00%, the added Cu reaches the saturated state and exists as a Cu-rich phase in the matrix, which has relatively little effect on the thermal conductivity. When the Cu content exceeds 2.65%, Cu-rich phases grow further and decrease in number. The changes in morphology, number and distribution of Cu-rich phases are conducive to free electron transport, thus slowing down the decrease in thermal conductivity with increasing Cu content