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基于双温度场耦合的铜板坯水平连铸过程有限元模拟
Finite Element Simulation of Copper Slab Horizontal Continuous Casting Process Based on Double Temperature Field Coupling
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- DOI:
- 作者:
- 刘劲松 1，2 ，张良利 1 ，王松伟 2 ，孔凡亚 2 ，刘羽飞 3 ，张 旺 3
LIU Jinsong1,2, ZHANG Liangli1 , WANG Songwei2 , KONG Fanya2 , LIU Yufei3 , ZHANG Wang3
- 作者单位:
- 1. 沈阳理工大学 材料科学与工程学院，辽宁 沈阳 110159；2. 中国科学院金属研究所 师昌绪先进材料创新中心，辽宁 沈阳 110016；3. 江西铜业集团铜板带有限公司，江西 南昌 330096
1. School of Materials Science and Engineering, Shenyang Ligong University, Shenyang 110159, China; 2. Shi-changxu Innovation Center for Advanced Materials, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China; 3. JCC Copper Strip Co., Ltd., Nanchang 330096, China
- 关键词:
- 水平连铸；数值模拟；结晶器；温度场；流场
horizontal continuous casting; numerical simulation; crystallizer; temperature field; flow field
- 摘要:
- 以铜合金板坯水平连铸过程为研究对象，利用有限元软件建立了板坯连铸结晶器的三维稳态模型，对结晶
器内铜液凝固降温和冷却水升温进行“双温度场”同步耦合模拟计算，分析了结晶器结构中冷却水温度场、速度场等分
布规律及其与铜液凝固过程之间的内在联系。 结果表明，当铸造温度为 1 170 ℃，进水温度为 28 ℃时，铜套壁面与石墨
板壁面温度场整体均以“双涡”形式分布，平均温度分别为 179.68、340.88 ℃；当铜套的进口水压分别为 0.4、0.5、0.6 MPa
时，与之对应的铸坯凝固时间分别为 27.82、13.76 和 9.76 s，即凝固速率加快，芯部的冷却强度加大，结晶线的弯曲弧度
减小；当出口水压增大时，铸坯边部的温降减缓，冷却强度降低，结晶线的弯曲弧度也随之减小。
Taking the horizontal continuous casting process of copper alloy slab as the research object, the three-dimensional steady-state mathematical model of slab continuous casting mold was accurately established by using finite element software, and the “double temperature field” synchronous coupling simulation calculation of copper liquid solidification cooling and cooling water heating in the mold was carried out. The distribution laws of cooling water temperature field and velocity field in the existing mold structure and its internal relationship with the solidification process of copper liquid were analyzed. The results show that when the casting temperature is 1 170 ℃ and the inlet water temperature is 28 ℃, the temperature field of the copper and graphite wall surface is distributed in the form of “double vortex”, and the average temperature is 179.68 ℃and 340.88 ℃, respectively. When the inlet water pressure of copper sleeve is respectively 0.4, 0.5 and 0.6 MPa, the solidification time of the corresponding billet is respectively 27.82, 13.76 and 9.76 s, that is, the solidification rate is accelerated, the cooling intensity in the middle is increased, and the bending radian of the crystal line decreases. When the outlet water pressure increases, the temperature drop at the edge of the billet slows down, the cooling intensity decreases, and the bending radian of the crystal line also decreases.